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REELYACTIVE obtient le programme de FounderFuel…

Comme pour FounderFuel, Digico est fier de s’associer à cette jeune entreprise et de faire partie de l’équipe de créateurs de demain.

Aegis disponible sur IPhone et IPad

Une bonne nouvelle est annoncée par notre fournisseur de logiciel manufacturier. Continuez à lire →

Soudures hautes précisions

Voici un mémo écrit par Cookson Electronics pour contrer les défis de soudure très pointu.  Reste à faire des tests.

Pour voir l’article directement sur leur site web  : Cookson Electronics



How does your ability to fine tune solder volume help increase your process efficiency and product performance?

ALPHA® Exactalloy® solder preforms address a wide variety of soldering challenges, including PBC assembly, automotive sub-assemblies, connectors and terminals, die attach, power module substrate attach, filtered connectors, and electronic component assembly.

Custom-designed shapes, sizes, alloys and flux types

Exactalloy® solder preforms are precisely formed pieces of solder suitable for volume manufacturing with very tight tolerances. They are manufactured in a wide variety of shapes, sizes, solder alloys and flux delivery systems to meet your requirements.

ALPHA® Exactalloy® Preform Selection Criteria

Alloy: Selection is based on melting point and compatibility with substrate materials. Exactalloy preforms are produced in a large variety of alloys to meet your specific application requirements. When used in combination with solder paste, the preform alloy matches the paste alloy.

Size/Shape: Custom designed sizes and shapes provide exact solder volume for specific applications, aiding the assembly process.

Flux Type: Based on the specific application, fluxes can be integrated with an Exactalloy® preform. Our applications engineers can help you select a flux that meets all applicable IPC standards. Color-coded fluxes are available for easy identification.

Key ALPHA® Exactalloy® Preform Applications

Preforms in Solder Paste: ALPHA® Exactalloy® Preforms can be used with solder paste to selectively increase solder volume. Tape-and-reel packaging provides a convenient method for the delivery of the preform with standard pick-and-place assembly equipment. The preform is picked from the tape-and-reel packaging, and placed directly into the solder paste prior to reflow. Only a portion of the preform needs to contact the paste. ALPHA Solder Preform Tape & Reel packaging provides you with a time-to-market advantage, solving your solder volume issues during assembly verification. Standard size 0402, 0403, 0603 and 0805 and smaller ALPHA® Preforms are readily available in tape-and-reel packaging.

ALPHA Exactalloy Preforms in solder paste
ALPHA Exactalloy Preforms in solder paste.

Solder Washers for PCB Assembly: ALPHA® Exactalloy® Preform solder washers provide you with an ideal method of not only delivering the precise solder volume and flux needed for through-hole connections, but they also eliminate the need for secondary solder processes. The preform solder washer can be placed on the connector pin during PCB assembly using pick and place equipment. Solder washers can also be integrated into production using various fixturing methods. The connector pins are then reflow soldered at the same time as the solder paste.

Bare pins, washers in place pre-reflow, post-reflow
Bare pins, washers in place pre-reflow, post-reflow

Solder-Copper Laminates: For applications that require laminated preforms, we offer solder/copper/solder laminates in washer, square, rectangular and disc shapes. A wide variety of alloys is feasible.

Lamination Specifications

Fuse Alloys: The combination of the precise solder volume and a specific melt temperature provides a fuse function, such as required in fire suppression systems. In addition to the very precise fuse function enabled by eutectic or near eutectic alloys, the solder can provide mechanical strength for the assembly. Cookson is leading the industry in cost effective solutions.


Exactalloy® Preforms

Solder Sleeves: Cookson’s patented manufacturing methods provide the vast majority of the industry’s volume for solder sleeves used in solder-based wire harness connectors. These products are the life blood of aeronautic, marine and specialty vehicles. The end products provide vibration resistant and moisture proof interconnection solutions. Ask about plans to support RoHS and ELV compliant offerings.

Solder Ribbon: Cookson’s high quality solder ribbon product offering provides the flexibility to integrate custom solder preforms into your product with your specialized material cutting and handling equipment, ensuring a cost-effective approach for high volume production.

Die Attach: Typically provided in high lead alloys, contaminate free solder materials – combined with Cookson process knowledge and expertise – offer a highly reliable die attach solution for demanding power applications. Our continuous R&D efforts in this area are providing new capabilities, further enhancing the cost performance of die attach solutions.

Substrate Attach: The heart of the power module that drives reliability is the DBC substrate. Cookson offers the highest performance high Sn alloys in the industry for the most demanding, highest reliability substrate to heat spreader attach. Ask about our newest alloy offering that extends system reliability.

Flexible Packaging Options: Packaging options are available to meet a variety of applications and assembly equipment requirements and are designed to maximize customer process efficiency. High-speed preform placement can be implemented using preforms packed on tape and reel, or in bulk feeder cartridges. Cookson also offers an assortment of trays, and bulk packaging options. Argon packaging is available for specific alloys.

Tape and Reel
Tape and reel

Common Alloys
* Rosin Superactivated

Available Flux Types: Flux is a critical element in the solder system. Cookson offers the widest variety of flux types to meet the most demanding applications, including color indicators for identification of RoHS versions on the shop floor. Ask us about how our resilient flux is expanding the range of potential solutions available for your application.

Cookson has a great deal of experience developing specialty shapes. Please contact your sales representative to learn more about how we can support your unique preform shape requirements.

Specification Guidelines
* Typical specifications shown, other dimensions available upon request.

Le RoHS2 arrive à grand pas

Voici un article intéressant qui démontre l’importance de se conformer à la directive RoHS2.  De la documentation sera requise afin de démontrer la conformité des produits expédiés et ce, à partir de l’approvisionnement des pièces.

Bonne lecture

5 Methodology steps to 6 sigma in electronics printed circuit board assemblies

Article très intéressant qui démontre l’importance de la prise de donnée DPMO effectué chez Digico.

5 Methodology steps to 6 sigma in electronics printed circuit board assemblies

By Lee Whiteman

An electronics manufacturer building one million circuit boards at 3 sigma levels would build 66,807 defective circuit boards. Assuming each defective board required $100 worth of parts and labor to repair, it would cost $6,680,700 to complete the repairs.

SOMEONE ONCE ASKED ME why 6 sigma is important in electronics. Why is there such a push for continuous process improvement at the design and manufacturing levels? From a practical sense, the real question should be: Can a company afford not to implement processes that will ensure 6 sigma quality?

Dense ball grid array (BGA) packages in electronics packaging routinely contain over 1,000 solder bumps. At minimum, there will be over 2,000 interconnections within the package that contain solder bumps and wire bonds between the package and die.

It is not beyond imagination that a printed circuit board could have over 100,000 interconnections – solder bumps and wire bonds – within the completed printed circuit board assembly.

For argument’s sake, let’s assume 10 printed circuit boards are manufactured, each with 100,000 interconnections.

For that lot of 10 printed circuit boards, there are 1,000,000 interconnections; 1,000,000 opportunities for failure within that lot.

In this simplified analogy, in a 6 sigma environment, four of the 1,000,000 interconnections could fail, as shown in Table 1. However, if the four interconnections are on individual printed circuit boards, it is possible 40% (4 of 10 circuit boards) would fail. This would be unacceptable in commercial markets, let alone high reliability markets such as medical, telecommunications, and aerospace electronics.

Table 1

Quality levels

Sigma quality defects per million opportunities (DPMO) and percent yield

Ideally, customers, regardless of electronics end-market, would want their circuit boards to approach 6 sigma levels – four card failures per 1,000,000 boards. Which means the design, manufacturing, and supply chain functions must focus their quality to levels approaching 7 sigma – two defects per 100,000,000.

From an economic standpoint, improving quality to a 6 sigma level makes practical sense.

If an electronics manufacturer built one million circuit boards at 3 sigma levels, they would build 66,807 defective circuit boards.

Assuming each defective board required $100 worth of parts and labor to repair, it would cost $ 6,680,700 to complete the repairs.

Conversely, if such manufacturer was at a 6 sigma level, they would encounter four circuit board failures, which costing $400 – a 99% reduction in repair costs.

As Dr. W. Edwards Deming illustrated, if variation is reduced, there is no need to inspect manufactured items for defects, because there won’t be any.

In addition, due to the complexity of fine pitch electronics, inspecting in quality becomes impractical, even with automated inspection capabilities. Therefore, by reaching 6 sigma, variation in the product becomes minimum.

Therefore, there is no economic or technical excuse for not pursuing a 6 sigma level.

The next question is how to achieve such world class levels.

As illustrated in Figure 1, employing a 6 sigma methodology can result in improvements in quality, which results in a reduction of production costs. The basis of this DMAIC methodology consists of the following:

  1. Define: Identify and document the processes used to design and manufacture the product.
  2. Measure: Quantify the processes used design and manufacture the product. It is critical that process metrics be quantified. Quantitative metrics are metrics that can be measured and be independently verified.Quantitative measures are arrived at through analysis, surveys, economic data, environmental data, and efficiency data. Qualitative metrics are based on judgment and are subject to different responses from different decision makers.Qualitative research methods include anecdotes, interviews, observation, discussion, and directed inquiry.
  3. Analyze: Based on the process definition and measurements, areas for improvement are identified.
  4. Improve: The current processes will be optimized and implemented, based upon data analysis performed.
  5. Control: Upon implementation of the optimized processes, this step quantifies any improvements made to the processes and provides feedback on performance.

Figure 1

6 Sigma methodology

Six sigma five step methodology

As Figure 1 illustrates, 6 sigma methodology – DMAIC – is a continuous improvement process, where processes are constantly monitored and analyzed to identify opportunities for improvement and to successfully implement new techniques.

Continuous improvement comprises of a set of actions that transform an organization to a better state of performance.

Motorola was the pioneer in introducing 6 sigma methodologies to electronics manufacturing in the 1980s. By their account, Motorola estimates it has launched thousands of improvement projects for a savings of about $17 billion.

However, manufacturing process improvement is only part of the solution.

Hardware designs, as complex as they can be, must be producible.

A non-producible product can reduce overall quality levels. In many cases, the root cause of a quality problem is the lack of adherence to published industry design guidelines.

For example, a densely packaged design had a series of fine pitch ball grid array packages. These packages were soldered with a thermal profile which should have resulted in acceptable solder joints.

When the process failed to produce a highly reliable product, the design and manufacturing processes were reviewed. It was determined a copper ground plane was designed into the circuit card directly under the fine pitch ball grid array packages, which reduced soldering temperatures sufficiently to result in a poor quality assembly.

Therefore, it is imperative all electronics manufactures achieve 6 sigma levels in their design and manufacturing processes. Failure to do so can result in loss of customers and a competitive edge in the global electronics manufacturing environment.

Write to Lee Whiteman at


Qualitative Measures for Teams in Transition by Lunell Haught; Haught Strategies; Spokane, Washington; ASQ Annual Spring Conference Proceedings, Chicago, IL, Vol. 23, No. 0, March 2001